Vancouver-based BTL Group files patent for its Interbit blockchain platform 23653 BTL and Interbit blockchain platform
News
Rakesh Ranjan Parashar
Sep 20, 2018 at 11:08 PM

BTL GROUP LTD. has announced that it has filed a sixth patent application or the “Hyperconvergence Application” for the Interbit blockchain platform, according to a press release.  Interbit platform is the 3rd generation platform being developed by the company.

The sole intention behind the development of this platform is to provide blockchain technology at the hypervisor level – the infrastructure technology at the heart of server virtualization.

BTM Group started working on this mega blockchain platform after getting feedbacks and insights from various companies from financial and energy sectors.

Speaking on the occasion, Tom Thompson, CTO of BTL and inventor of the InterbitTM platform said, “While our patent strategy has remained unchanged, the vision for the mechanics and functionality of our InterbitTM platform has expanded to millions of blockchains being supported, along with targeted applications and solutions.”

Interbit is a blockchain development platform designed for business innovators and developers to quickly and easily incorporate the best of blockchain capabilities into enterprise applications.

“Since the InterbitTM platform’s release in April for feedback and testing, we have been presented with demand scenarios that require scaling up to millions of blockchains and accordingly we are taking steps to upgrade the platform’s capabilities to attempt to meet those challenges,” he added.

The "Hyperconvergence Application" allows a single application blockchain to control different hypervisors, across different nodes.

Stressing the growing need for a mega-chain scale solution, Dominic McCann, CEO of BTL said, “In the last 12 months we have seen new demand for complex mega-chain scale solutions running millions of blockchains that we intend to address by unique features in our Interbit platform."

The first two of the six patent applications filed for the Interbit platform were submitted in October 2017.

The company also filed three additional patent applications:

  • Payload Layer: The Payload Layer allows large file transfer with only a small reference file being stored on the chain, thereby allowing the chain to continue normal processing during the large file transfer.
  • Chainception: Interbit can spawn new blockchains, and this application covers automatically distributing these new chains across multiple hardware hosts as children of the parent chain.
  • Side Effects: Side Effects refer to hardware interactions affected by blockchains.

The patent-pending InterbitTM blockchain platform addresses two main issues in the blockchain arena-scalability and security, which still remain the main impediments in a wider adoption of the blockchain.

See Also: Blockchain to take center stage at American National Standards Institute forum

Public and private blockchains to converge thanks to IBM

Image via Shutterstock

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